Capillary underfill and mold encapsulation materials for exposed die flip chip molded matrix array package with thin substrate

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 324-330

  Kooi, Chee Choong ^a   Shing, Lim Szu ^a   Periaman, S ^a   Chui, J ^a   Then, E ^a   Huat, Ng Cheong ^a   Fai, Low Mun ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MOLDS; RELIABILITY;

HIGH RELIABILITY; MATRIX ARRAYS; MOLD COMPOUNDS; MOLDED MATRIX ARRAY PACKAGES; RELIABILITY PERFORMANCE; STRESS TEST; THIN SUBSTRATE; UNDERFILLS;

CHIP SCALE PACKAGES;

EID: 84877783331     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271539     Document Type: Conference Paper

References (10)

1. Chee C. K., Chin Y. T. et al "Lead-Free Compatible Underfill Materials For Flip Chip Applications" Proc, ECTC 2002, pp 417-427.
2. Usui H., Mizutani M. et al "Special Characteristic Of Future Flip Chip Underfill Materials And Process" Proc, ECTC 2000, pp. 1661-1665.
3. Chai K., Wu L. "The Underfill Processing Technology For Flip Chip Packaging" Proc, ECTC 2001
4. Rector L. P., Gong S. et al "On The Performance Of Epoxy Molding Compounds For Flip Chip Transfer Molding Encapsulation" Proc, ECTC 2001, pp. 293-297.
5. Liu F., Wang Y. P. et al "Characterisation Of Molded Underfill For Flip Chip Ball Grid Array Packages"Proc, ECTC 2001, pp. 288-292.
6. Bair H. E., Boyle D. J. et al "Thermomechanical Properties of IC Molding Compounds" Polym Eng and Sc, 1990, No. 10, pp. 609-617.
7. Chee C. K., Sterrett T. et al "MC: The Lead-free Compatible Underfill Materials For Flip Chip Applications" Proc, GlobalTRONICS 2002, pp 47-54.
8. Chee C.K. Lim S.S. et al "Lead-free Molded Underfill Technology for Exposed Die Flip Chip Packages Assembled in A Molded Matrix Array Packages Form" Proc, ECTC 2003, pp 962-970
9. Chandran D. P. K., Chee C. K. et al "Thermal Characterizations of High Temperature Reflow Compatible Epoxy Molding Compounds Used In The Lead-Free Applications" Proc, IMAPS 2002.
10. He Y. "Thermal Characterization of Overmolded Underfill Materials for Stacked Chip Scale Packages" Proc, NATAS 2002.