Molded flip chip BGA characterization

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 109-114

  Kao, Nicholas ^a   Lai, Jeng Yuan ^a   Wang, Ming Zong ^a   Wang, Yu Po ^a   Hsiao, C S ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INJECTION MOLDING; MOISTURE; MOLDING; SHEET MOLDING COMPOUNDS; SUBSTRATES; THERMAL EFFECTS;

ELECTRICAL PERFORMANCE; MOISTURE SENSITIVITY LEVEL (MSL); MOLDED STRUCTURE; THERMAL PERFORMANCE;

FLIP CHIP DEVICES;

EID: 28444494444     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Yu Po Wang, Kevin Chai, Steve Chiu, H. P. Pu, T. D Her, and Randy Lo, "Underfill study of Flip Chip Ball Grid Array Package", Semicon Taiwan 2000, pp.133-139.
2. Yung Sen Lin, Kevin Chai, T. D Her, and Randy Lo, "Transfer Molded Underill for FC-BGA", Semicon Taiwan 2000, pp. 153-157.
3. J. H. Lau, Flip Chip Technologies, McGraw-Hill, New York, NY, 1996.
4. C. P. Wong, S. H. Shi and G. Jefferson, "High Performance No Flow Underfills for Low-Cost Flip-Chip Applications", Proceedings of IEEE Electronic Components & Technology Conference, May 1997, pp. 850-503.
5. Fenny Liu, Yu Po Wang, Kevin Chai and T. D. Her, "Characterization of Molded Underfill Material for Flip Chip Ball Grid Array Packages", Electronic Components and Technology Conference, 2001.