Three-dimensional inspection of ball grid array using laser vision system

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 2, 1999, Pages 151-155

  Kim, Pyunghyun ^a   Rhee, Sehun ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER VISION; ERROR ANALYSIS; IMAGE ANALYSIS; IMAGE SEGMENTATION; INSPECTION; LASER APPLICATIONS; MATHEMATICAL MODELS; QUALITY CONTROL; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAYS (BGA); FEATURE-BASED ALGORITHMS; LASER VISION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0033311130     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.778175     Document Type: Article

References (6)

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2. S. M. Rooks, B. Benhabib, and K. C. SmithDevelopment of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography," IEEE Trans. Comp., Packag., Manufact. Technol. A. vol. 18, pp. 851-861, Dec. 1995.
3. A. R. Kalukin and V. SankaranThree-dimensional visualization of multilayered assemblies using X-ray laminography," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 20, pp. 361-366, Sept. 1997.
4. D. J. Svetkoff, D. K. Rohner, D. A. Nohleti, and R. L. JacksonMethod and system for triangulation-based, 3-D imaging utilizing an angled scanning beam of radiant energy," U.S. Patent 5617209, Apr. 1997.
5. R. C. Gonzalez and R. E. Woods, Digital Image Processing. Reading, MA: Addison-Wesley, 1993, pp. 414-429.
6. D. F. Rogers and J. A. Adams, Mathematical Elements for Computer Graphics, 2nd ed. New York: McGraw-Hill, 1990, pp. 435-458.