SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading

International Journal of Fracture

Volumn 151, Issue 2, 2008, Pages 269-279

  Wang, Xi Shu ^a   Yan, Cheng Kun ^a   Li, Ying ^a   Xue, Yibin ^b   Meng, Xiang Kang ^c   Wu, Bi Sheng ^d  

^a TSINGHUA UNIVERSITY   (China)

^b Utah State University   (United States)

^c NANJING UNIVERSITY   (China)

^d UNIVERSITY OF WOLLONGONG   (Australia)

Author keywords

Copper; Failure behavior; Multi layered films; Nickel; Substrate

Indexed keywords

BENDING (DEFORMATION); BENDING TESTS; COPPER; CRACKING (CHEMICAL); DEFORMATION; FRACTURE; MICROSCOPIC EXAMINATION; SECONDARY EMISSION; THICK FILMS; THIN FILM DEVICES; THIN FILMS;

CRACKING PATTERNS; EXPERIMENTAL OBSERVATIONS; FAILURE BEHAVIOR; FILM FRACTURES; IN-SITU; INTERFACIAL STRENGTHS; MULTI-LAYERED FILMS; NANOCRYSTALLINE CU; PERIODIC; POINT BENDING; THREE-POINT BENDING TESTS;

SUBSTRATES;

EID: 54249156904     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-008-9257-8     Document Type: Article

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