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Materials Transactions

Volumn 48, Issue 10, 2007, Pages 2795-2798

SEM in situ study on deformation behavior of Cu and Cu/Ni films under three-point bending

(3) Huang, Jianguo a Wang, Xishu b Meng, Xiangkang a

a NANJING UNIVERSITY (China)

b TSINGHUA UNIVERSITY (China)

Author keywords

Failure mechanism; In situ observation; Metallic films; Three point bending

Indexed keywords

DEFORMATION; FAILURE ANALYSIS; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY;

FAILURE MECHANISM; IN SITU OBSERVATION; THREE-POINT BENDING;

METALLIC FILMS;

EID: 36549010076 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.MRP2007069 Document Type: Conference Paper

Times cited : (13)

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