Buckling behavior of metal film/substrate structure under pure bending

Applied Physics Letters

Volumn 92, Issue 13, 2008, Pages

  Li, Ying ^a   Wang, Xi Shu ^a   Meng, Xiang Kang ^b  

^a TSINGHUA UNIVERSITY   (China)

^b NANJING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; CRYSTAL STRUCTURE; SCANNING ELECTRON MICROSCOPY; STRESSES; SUBSTRATES;

EXTRINSIC STRESSES; SUBSTRATE STRUCTURE; THEORETICAL ANALYSIS;

METALLIC FILMS;

EID: 41649114148     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2897035     Document Type: Article

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20. Although Eq. is derived for elastic film, it used here just for approximately evaluating the critical buckling strain εc for the Cu film on the Cu substrate. As the Cu film was under the plastic deformation, Eq. could be not proper for obtaining the exactly critical strain. According to the theory of elastic stability by Timoshenko and Gere [Theory of Elastic Stability, 2nd Ed. (McGraw-Hill, New York, 1963)] and the copper characterized by the power law (Refs.), the critical strain of the Cu film could be slightly larger than the εc obtained by Eq.. However, the shrink strain in the Cu film is still larger than the critical buckling strain and also could induce the buckling of Cu film.