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Volumn 55, Issue 10, 2008, Pages 2712-2717

Effects of parasitic capacitance, external resistance, and local stress on the RF performance of the transistors fabricated by standard 65-nm CMOS technologies

Author keywords

Effective gate width; Gate poly (GP) pitch; Layout effects; Radio frequency (RF) performance

Indexed keywords

CMOS INTEGRATED CIRCUITS; TRANSISTORS; WELDS;

EID: 53649108382     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2008.2003995     Document Type: Article
Times cited : (12)

References (11)
  • 3
    • 73049118736 scopus 로고    scopus 로고
    • Layout optimization of RF CMOS in the 90 nm generation by a physics-based model including the multi-finger wiring effect
    • A. Nakamura, N. Yoshikawa, T. Miyazako, T. Oishi, H. Ammo, and K. Takeshita, "Layout optimization of RF CMOS in the 90 nm generation by a physics-based model including the multi-finger wiring effect," in Proc. RFIC Symp., 2006, pp. 419-422.
    • (2006) Proc. RFIC Symp , pp. 419-422
    • Nakamura, A.1    Yoshikawa, N.2    Miyazako, T.3    Oishi, T.4    Ammo, H.5    Takeshita, K.6
  • 4
    • 84957885796 scopus 로고    scopus 로고
    • Geometry optimization of sub-100 nm node RF CMOS utilizing three dimensional TCAD simulation
    • T. Tatsumi, "Geometry optimization of sub-100 nm node RF CMOS utilizing three dimensional TCAD simulation," in Proc. ESSDERC, 2006, pp. 319-322.
    • (2006) Proc. ESSDERC , pp. 319-322
    • Tatsumi, T.1
  • 5
    • 26244451388 scopus 로고    scopus 로고
    • Effect of extrinsic impedance and parasitic capacitance on figure of merit of RE MOSFET
    • Sep
    • W. Yeh, C. Ku, S. Chen, Y Fang, and C. P. Chao, "Effect of extrinsic impedance and parasitic capacitance on figure of merit of RE MOSFET," IEEE Trans. Electron Devices, vol. 52, no. 9, pp. 2054-2060, Sep. 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , Issue.9 , pp. 2054-2060
    • Yeh, W.1    Ku, C.2    Chen, S.3    Fang, Y.4    Chao, C.P.5
  • 6
    • 0034499917 scopus 로고    scopus 로고
    • Gate layout and bonding pad structure of a RE n-MOSFET for low noise performance
    • Dec
    • C. S. Kim, J. Park, H. K. Yu, and H. Cho, "Gate layout and bonding pad structure of a RE n-MOSFET for low noise performance," IEEE Electron Device Lett., vol. 21, no. 12, pp. 607-609, Dec. 2000.
    • (2000) IEEE Electron Device Lett , vol.21 , Issue.12 , pp. 607-609
    • Kim, C.S.1    Park, J.2    Yu, H.K.3    Cho, H.4
  • 11
    • 0036932273 scopus 로고    scopus 로고
    • Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance
    • R. A. Bianchi, G. Bouche, and O. Roux-dit-Buisson, "Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance," in IEDM Tech. Dig., 2002, pp. 117-120.
    • (2002) IEDM Tech. Dig , pp. 117-120
    • Bianchi, R.A.1    Bouche, G.2    Roux-dit-Buisson, O.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.