Recent progress of ohmic contact on ZnO

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Yao, Lv ^a   Lixi, Wan ^a  

^a INSTITUTE OF MICROELECTRONICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; ACOUSTIC SURFACE WAVE FILTERS; ACOUSTIC TRANSDUCERS; ACOUSTIC WAVES; ACOUSTICS; CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; ELECTRIC CONTACTORS; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FILMS; INTERNET PROTOCOLS; METALLIC FILMS; METALS; OHMIC CONTACTS; OPTICAL DESIGN; PIEZOELECTRIC TRANSDUCERS; POWER ELECTRONICS; SENSOR NETWORKS; SENSORS; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; THERMODYNAMIC STABILITY; TRANSDUCERS; ZINC ALLOYS; ZINC OXIDE;

CHEMICAL-; CONTACT-RESISTANCE; DEVICE FABRICATIONS; ELECTRONIC PACKAGING; ENERGY-BAND BENDING; GAS SENSORS; HIGH-DENSITY PACKAGING; HIGH-POWER ELECTRONICS; INTERNATIONAL CONFERENCES; LOW-RESISTANCE; NANO-SCALE FILMS; PHOTONIC APPLICATIONS; RECENT PROGRESS; SENSOR NODES; SURFACE ACOUSTIC WAVE DEVICES; SYSTEM IN PACKAGING; THERMAL STABILITY; UV LIGHT EMITTERS; ZNO FILMS;

SEMICONDUCTING ZINC COMPOUNDS;

EID: 52449113763     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606940     Document Type: Conference Paper

References (24)

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