A simplified thermal resistance network model for high power LED street lamp

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

Volumn , Issue , 2008, Pages

  Luo, Xiaobing ^a,b   Xiong, Wei ^a   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DC GENERATORS; ELECTRONICS PACKAGING; ESTIMATION; HEAT RESISTANCE; HEAT SINKS; HEAT STORAGE; LIGHTING; PHYSICAL OPTICS; ROADS AND STREETS; STREET LIGHTING; TECHNOLOGY;

ELECTRONIC PACKAGING; ENVIRONMENT TEMPERATURE; EXPERIMENTAL INVESTIGATIONS; HEAT SINK TEMPERATURE; HIGH POWERS; HIGH-DENSITY PACKAGING; HIGH-POWER LED; INTERNATIONAL CONFERENCES; LIGHT-EMITTING DIODE; OPTICAL EXTRACTION; ROOM TEMPERATURES; SINK TEMPERATURES; TEMPERATURE ESTIMATIONS; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL RESISTANCE;

LIGHT EMITTING DIODES;

EID: 52449111308     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2008.4606976     Document Type: Conference Paper

References (18)

1. Alan, M.: 'Solid state lighting-a world of expanding opportunities at LED 2002', III-Vs Review, 2003, 16, (1), pp.30-33
2. Alan, M.: 'Lighting: The progress & promise of LEDs', III-Vs Review, 2004, 17, (4), pp. 39-41
3. Narendran, N., and Gu, Y. M.: 'Life of LED-Based white light sources', IEEE Journal of Display Technology, 2005, 1, (1), pp.167-171
4. Wilcoxon, R. and Cornelius, D.: 'Thermal Management of an LED Light Engine for Airborne Applications'. Proc. 22th IEEE Semiconductor Thermal Measurement and Management Symposium, Dallas TX, USA, March 2006, pp. 178-185
5. Kim, S. K., Kim, S. Y., and Choi, Y. D.: 'Thermal performance of cooling system for red, green and blue LED light source for rear projection TV, Proceeding of The Tenth Intersociety Conference on Thermal and Therrnomechanical Phenomena in Electronics Systems, San Diego, CA, USA, May 2006, pp.377-379
6. Liu, S., Lin, T., Luo X.B., Chen, M.X., and Jiang, X.P.: 'A microjet array cooling system for thermal management of active radars and high-brightness LEDs', Proc. Fifty-Sixth Electronic Components & Technology Conference, San Diego, CA, USA, May 2006, pp. 1634-1638
7. Luo, X.B., Chen W., Sun R.X., and Liu S.: 'Experimental and Numerical Investigation of a Microjet Based Cooling System for High Power LEDs', Heat Transfer Engineering, In press
8. Luo, X.B., Liu S.: 'A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs', IEEE Journal of Advanced Packaging, 2007, 30, (3), pp. 475-484
9. Petroski, J.: 'Understanding longitudinal fin heat sink orientation sensitivity for Light Emitting Diode (LED) lighting applications', Proc. International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA, July 2003, pp. 111-117
10. Chen, J.H., Liu, C.K., Chao, Y.L., and Tain, R.M.: 'Cooling performance of silicon-based thermoelectric device on high power LED', Proc. 24th International Conference on Thermoelectrics, Clemson, South Carolina, USA, June 2005, pp.53-56
11. Acikalin, T., Garimella, S.V., Petroski, J., and Arvind, R.: 'Optimal design of miniature piezoelectric fans for cooling light emitting diodes', Proc. Ninth Intersociety Conference on Thermal and Therrnomechanical Phenomena in Electronic Systems, Las Vegas, Nevada, USA, June 2004, pp. 663-671
12. Treurniet, T., and Lammens, V., : 'Thermal management in color variable multi-chip LED modules', Proc. 26th IEEE Semiconductor Thermal Measurement And Management Symposium, SEMI-THERM 2006, Dallas, Texas, USA, March 2006, pp. 173-177
13. Arik, M., and Weaver, S.,: 'Chip scale thermal management of high brightness LED packages', Procceedings of SPIE v 5530, 4th International Conference on Solid State Lighting, Denver, Colorado, USA, August 2004, pp. 214-223
14. Tan, L.X., Li J., Liu, Z.Y., Wang, K., Wang, P., Gan, Z.Y., and Liu, S.,: 'A Light Emitting Diode's Chip Structure withLow Stress and High Light Extraction Efficiency', Proc. Fifty-Eigth Electronic Components & Technology Conference, USA, May 2008, pp.783-788
15. Luo, X.B., Cheng, T., Xiong, W., Gan, Z.Y., Liu, S., Thermal Analysis on an 80W LED Street Lamp, IET Optoelectronics, 2007, 1, (5), pp. 191-196
16. S. Song, S. Lee, V. Au, Closed-form equation for thermal constriction/spreading resistances with variable resistance boundary condition, in: Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, Georgia, 1994, pp. 111-121
17. S. Lee, S. Song, V. Au, K.P. Moran, Constriction/spreading resistance model for electronics packaging, in: ASME/JSME Thermal Engineering Conference, vol. 4, Maui, Hawaii, 1995, pp. 199-206
18. Bar-Cohen, A., Iyengar, M, and Kraus, A.D., Design of Optimum Plate Fin Natural Convection Heat Sinks, ASME Transactions - Journal of Electronic Packaging, 2003, Vol 125, Number 2, pp 208-216