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Volumn 2, Issue , 2003, Pages 111-117
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Understanding longitudinal fin heat sink orientation sensitivity for Light Emitting Diode (LED) lighting applications
a
GELcore
(United States)
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Author keywords
Heat sink; Heat transfer; LED; Light emitting diode; Natural convection; Thermal
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Indexed keywords
CHANNEL FLOW;
COMPUTATIONAL GEOMETRY;
COOLING SYSTEMS;
FLOW INTERACTIONS;
HEAT RADIATION;
LIGHT EMITTING DIODES;
MOUNTINGS;
NATURAL CONVECTION;
NUSSELT NUMBER;
REYNOLDS NUMBER;
THERMAL CONDUCTIVITY;
DIODES;
ELECTRONICS PACKAGING;
ENERGY TRANSFER;
FINS (HEAT EXCHANGE);
HEAT TRANSFER;
LIGHT EMISSION;
LIGHTING;
PHYSICAL OPTICS;
WATER ANALYSIS;
AIRFLOW;
FREE CONVECTIVE COOLING SYSTEMS;
ORIENTATION DYNAMICS;
RADIANT ENERGY TRANSFER;
RAYLEIGH NUMBER;
CONVECTIVE COOLING;
CONVENTIONAL LIGHT SOURCES;
COOLING METHODS;
CYLINDRICAL TUBES;
HEAT TRANSFER SYSTEMS;
HIGH TEMPERATURE;
JUNCTION TEMPERATURES;
LED;
LIGHTING APPLICATIONS;
LIGHTING METHODS;
LONGITUDINAL FIN;
PARADIGM SHIFTS;
PARALLEL PLATES;
RADIANT HEAT TRANSFER;
TEST RESULTS;
THERMAL;
VERTICAL DOWN;
VERTICAL UP;
FINS (HEAT EXCHANGE);
LIGHT EMITTING DIODES;
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EID: 1242331931
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1115/ipack2003-35055 Document Type: Conference Paper |
Times cited : (16)
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References (4)
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