Thermal management of an LED light engine for airborne applications

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 2006, Issue , 2006, Pages 178-185

  Wilcoxon, Ross ^a   Cornelius, Dave ^a  

^a ROCKWELL COLLINS   (United States)

Author keywords

Die Attach Voiding; Light Emitting Diode; Light Engine; Thermal Design Case Study; Thermal Management

Indexed keywords

DIE ATTACH VOIDING; LIGHT ENGINES; THERMAL DESIGN; THERMAL MANAGEMENT;

COMPUTER SIMULATION; DISPLAY DEVICES; HEAT FLUX; HEAT RESISTANCE; LIGHT EMISSION; THERMAL EFFECTS;

LIGHT EMITTING DIODES;

EID: 33750137116     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Arik, M., Petroski, J., and Weaver, S., "Thermal Challanges [sic] in the Future Generation Solid State Lighting Applications: Light Emitting Diodes", Proc. of the 2002 Inter Society Conference on Thermal Phenomena, pp. 113-120, 2002.
2. Huh, C., Schaff, W., Eastman, L.F., and Park, S., "Temperature Dependence of Performance of InGaN/GaN MQW LEDs With Different Indium Compositions", IEEE Electron Device Letters, Vol. 25, No. 2, pp. 61-63, 2004.
3. Bera, S.C., Singh, R.V., and Garg, V.K., "Temperature Behavior and Compensation of Light-Emitting Diode", IEEE Phontonics Technology Letters, Vol. 17, No. 11, pp. 2286-2288, 2005.
4. Petroski, J. "Spacing of High-Brightness LEDs on Metal Substrate PCB's for Proper Thermal Performance", Proc. of the 2004 Inter Society Conference on Thermal Phenomena, pp. 507-514, 2004
5. http://www.cree.com/index.html
6. http://www.ansys.com/
7. IMAPS Thermal Management Advanced Technology Workshop, Palo Alto, CA, October 23-26, 2005