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Volumn 31, Issue 10, 2008, Pages 46-50

How pump-induced particles affect low-k CMP detectivity

Author keywords

[No Author keywords available]

Indexed keywords


EID: 52449095918     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (4)

References (17)
  • 1
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    • (2002) MRS Bulletin , vol.27 , Issue.10 , pp. 752
    • Singh, R.K.1
  • 3
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    • Comparison of Vacuum-Pressure vs. Pump Dispense Engines for CMP Slurry Distribution
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  • 4
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    • Handling and Filtration Evaluation of a Colloidal Silica CMP Slurry
    • R.K. Singh, G. Conner and B.R. Roberts, "Handling and Filtration Evaluation of a Colloidal Silica CMP Slurry," Solid State Technology, 2004, Vol. 47, p. 61.
    • (2004) Solid State Technology , vol.47 , pp. 61
    • Singh, R.K.1    Conner, G.2    Roberts, B.R.3
  • 5
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    • Effect of Shear Stress and Pump Methods on CMP Slurry
    • November
    • M. Litchy and R. Schoeb, "Effect of Shear Stress and Pump Methods on CMP Slurry," Semiconductor International, November 2004, Vol. 27, No. 12, p. 87
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    • Litchy, M.1    Schoeb, R.2
  • 6
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    • R.K. Singh and B.R. Roberts, "On Extensive Pump Handling of Chemical-Mechanical Polishing Slurries," IEEE/SEMI Adv. Semi. Mfg. Conf., 2001, p. 107.
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  • 7
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    • Effect of Particle Size Distribution on Filter Lifetime In Three Slurry Pump Systems
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    • (2005) MRS Symp. Proc , vol.867
    • Litchy, M.1    Schoeb, R.2
  • 9
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    • Analysis of Large Particle Count in Fumed Silica Slurries and Its Correlation with Scratch Defects Generated by CMR
    • E.E. Remsen et al., "Analysis of Large Particle Count in Fumed Silica Slurries and Its Correlation with Scratch Defects Generated by CMR" J. of the Electrochem. Soc., 2006, Vol. 153, p. G453.
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    • Remsen, E.E.1
  • 10
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    • 191 7
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    • von Smoluchowski, M.1
  • 11
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    • Kinetic Theory of Shear Coagulation for Particles in a Viscous Fluid
    • K. Higashitani, R. Ogawa, G. Hosokawa and Y. Matsuno, "Kinetic Theory of Shear Coagulation for Particles in a Viscous Fluid," J. Chem. Eng. Jpn., 1982, Vol. 15, p. 299.
    • (1982) J. Chem. Eng. Jpn , vol.15 , pp. 299
    • Higashitani, K.1    Ogawa, R.2    Hosokawa, G.3    Matsuno, Y.4
  • 13
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    • Chemical Processes in Glass Polishing
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  • 14
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    • G.B. Basim et al., "Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects," J. of the Electrochem. Soc., 2000, Vol. 147 p. 3523.
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    • Zeng, T.F.1    Sun, T.2
  • 17
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    • Effects of CMP Process Conditions on Defect Generation In Low-k Materials
    • N. Chandrasekaran et al., J. of the Electrochem. Soc., "Effects of CMP Process Conditions on Defect Generation In Low-k Materials," 2004, Vol. 151, p. G882.
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    • Chandrasekaran, N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.