On extensive pump handling of chemical-mechanical polishing slurries

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue 2, 2001, Pages 107-113

  Singh, R K ^a   Roberts, B R ^a  

^a BOC Edwards   (United States)

Author keywords

CMP Slurry; Particle Counts; Particle Distribution; Pump Handling; Slurry Distribution

Indexed keywords

ALUMINA; PARTICLE SIZE ANALYSIS; SHEARING; SILICON COMPOUNDS; SLURRIES; VACUUM PUMPS; VACUUM TECHNOLOGY;

LARGE PARTICLE COUNTS (LPC);

CHEMICAL MECHANICAL POLISHING;

EID: 0035176998     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Effect of particle size of chemical mechanical polishing with minimal defects
2. The importance of particle size to the performance of abrasive particles in the CMP process
3. Comparison of vacuum-pressure vs. pump dispense engines for CMP slurry distribution
4. Handling characteristics of a new STI chemical-mechanical polishing slurry
5. Behavior of CMP slurry properties in continuous blending and distribution systems
6. Slurry quality and consistency in a continuous slurry blending and distribution system
7. Characterization of circulated chemical-mechanical polishing slurry particles using two analysis methods
8. Accelerated aging and handling evaluation of rodel ILD 1300 oxide CMP slurry in FSI bulk slurry delivery system
9. On sedimentation and redispersion of abrasive particles in CMP slurries
10. CMP slurry metrology: Various approaches
11. Perturbation detection analysis: A method for comparing instruments that measure CMP slurry health
12. Analysis of chemical-mechanical polishing slurry characteristics and analyzers