New proposed adhesive tape application mechanism for stacking die applications

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 309-315

  Cheung, Y M ^a   Chong, A C M ^a  

^a ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Assembly; Bonding processes; Delamination; Electronics packaging; Finite element methods; Silicon; Space technology; Stacking; Wafer bonding; Wire

Indexed keywords

ASSEMBLY; CHARGE TRAPPING; CHIP SCALE PACKAGES; CHUCKS; DELAMINATION; DIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); SILICON; SILICON WAFERS; WIRE;

BONDING PROCESS; DELAMINATION FAILURE; FINITE ELEMENT SIMULATIONS; OPTIMIZED CONFIGURATION; SPACE TECHNOLOGIES; STACKING; STRAIN/STRESS DISTRIBUTION; WAFER THINNING TECHNOLOGY;

WAFER BONDING;

EID: 84946405917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298748     Document Type: Conference Paper

References (2)

1. Pienimaa, S.K. Valtanen, J. Heikkila, R. and Ristolainen, E. (2001) Stacked Thin Dice Packaging, pp361-366.
2. Sandra, W. (2002) Advanced IC packaging markets and trends, sixth edition, Electronic trend publications, Inc., California, USA.