Scaling effects on grain size and texture of lead free Interconnects - Investigations by electron backscatter diffraction and nanoindentation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 75-81

  Krause, M ^a   Muller M ^b   Petzold, M ^a   Wiese, S ^b   Wolter, K J ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BACKSCATTERING; COMPUTER NETWORKS; DIFFRACTION; ELECTRON DIFFRACTION; GRAIN (AGRICULTURAL PRODUCT); GRAIN SIZE AND SHAPE; INTERMETALLICS; MECHANICAL PROPERTIES; METALLIZING; NANOINDENTATION; SEMICONDUCTING INTERMETALLICS; WELDING;

ELECTRON BACK-SCATTER DIFFRACTION; ELECTRONIC COMPONENTS; SOLDER INTERCONNECTS; SOLDER MATERIAL;

SOLDERING ALLOYS;

EID: 51349163254     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4549953     Document Type: Conference Paper

References (11)

1. Oacha, F.; Williams, J.J.; Chawla, N.: "Effects of Cooling Rate on the Microstructure and Tensile Behavior of a Sn-3.5wt.% Solder" Journal of Electronic Materials, Vol. 32,No. 12 (2003), pp. 1414-1420.
2. Wiese, S.; Roellig, M.; Mueller, M.; Rzepka, S.; Nocke, K.; Luhmann, C.; Kraemer, F.; Meier, K.; Wolter, K.-J.: "The Influence of Size and Composition on the Creep of SnAgCu Solder Joints" Proc 1st Electronics Systemintegration Technology Conference, 2006, Volume 2, Sept. 2006, pp.912 - 925
3. Joo, D.K.; Jin Yu: "Effects of microstructure on the creep properties of the lead-free Sn-3.5Ag-Cu solders" Proc 52 Electronic Components and Technology Conference, 2002, 28-31 May 2002 pp.1221 - 1225
4. Wiese, S.; Kraemer, F.; Krause, M.; Bennemann, S.; Müller, M.; Roellig, M.; Petzold, M.; Wolter, K.-J.: "Compositional Effects on the Creep Properties of SnAgCu Solder." Proc EuroSimE 2006 ,pp. 648-653
5. th Electronic Components and Technology Conference, 2002, May 29- Junel, 2007, pp.1579 - 1588
6. th Int. Sympos. on Testing and Failure Analysis (ISTFA), 2004, Worcester (MA), pp. 338-345.
7. Isabell, T. C.: "Resolution and sensitivity of electron backscattered diffraction in a cold field emission gun SEM", Ultramicroscopy 67, 1997
8. Oliver, W.C.; Pharr, G.M.: "An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Methods", Journal of Material Research, Vol. 7 (1992), pp.1563-1583.
9. Petzold, M.; Bennemann, S.; Graff, A.; Krause, M.; Müller, M.; Wiese, S.; Wolter, K.-J.: " Analytical and mechanical methods for material property investigations of SnAgCu-solder", Proc Electronics Systemintegration Technology Conference, 2006. 1st, Volume 2, Sept. 2006
10. Lehman, L.P.; Athavale, S.N.; Fullem, T.Z.; Giamis, A.C.; Kinyanjui, R.K.; Lowenstein, M.; Mather, K.; Patel, R.; Rae, D.; Wang, J.; Xing, Y.; Zavalij, L.; Borgesen, P.; Cotts, E.J. : "Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder" Journal of Electronic Materials, Vol. 33, No. 12 (2004), pp. 1429-1439.
11. Kang, S.K.; Choi, W.K.; Shi, D.-Y.; Henderson, D.W.; Puttlitz, K.J.: "Microstructure and mechanical properties of lead free solders and solder joints used in microelectronic applications" Journal of Research and Development, Vol. 49, No. 4/5 (2005), pp. 607-619.