Analytical and mechanical methods for material property investigations of SnAgCu-Solder

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 376-382

  Petzold, M ^a   Bennemann, S ^a   Graff, A ^a   Krause, M ^a   Muller M ^b   Wiese, S ^b   Wolter, K J ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; MICROSTRUCTURE; RELIABILITY; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

RELIABILITY PROPERTIES;

SOLDERING ALLOYS;

EID: 42549161418     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280029     Document Type: Conference Paper

References (7)

1. S. Wiese, F. Krämer, M. Krause, S. Bennemann, M. Müller, M. Röllig, M. Petzold, K.-J. Wolter, "Compositional Effects on the Creep Properties of SnAgCu Solder", 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006, Como, April 24 -26 (2006), pp. 648-653.
2. P.A. Kramer, J. Glazer, Jr. Morris, "The Effect of Low Gold Concentrations on the Creep of Eutectic Tin-Lead Joints". Metallurgical and Materials Trans. A, Vol. 25A (1994), pp. 1249 - 1257.
3. W.C. Oliver, G.M. Pharr, "An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Methods", Journal of Material Research, Vol. 7 (1992), pp.1563-1583.
4. W. Mack, B. Seidl, R. Fischer, T. Ort, J. Walter, J. Grünewald, L. Berthold, M. Petzold, "Ion Beam Polishing as Final Treatment for Embedded Cross-Sections and its Advantages for FESEM Analysis in Electronic Packaging", Proc. 30. Int. Sympos. on Testing and Failure Analysis (ISTFA) 2004, Worcester (MA), pp. 338-345.
5. th Electronics Components and Technology Conference, Orlando, FL, May 2005, pp. 272-279.
6. S. Bennemann et al., "A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package", to be published at Electronics Systemintegration Technology Conference, 2006, Dresden.
7. M. Krause, "Microstructure and local mechanical properties of solder interconnects in microelectronic components", Diploma thesis 2006, Physics department, Martin-Luther-University Halle-Wittenberg.