The influence of size and composition on the creep of SnAgCu solder joints

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 912-925

  Wiese, S ^a   Roellig, M ^a   Mueller, M ^a   Rzepka, S ^a,b   Nocke, K ^a,b   Luhmann, C ^a,b   Kraemer, F ^a   Meier, K ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b QIMONDA DRESDEN GMBH AND CO OHG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; FLIP CHIP DEVICES; MICROSTRUCTURE; THERMAL EFFECTS; TIN ALLOYS;

FLIP CHIP SOLDER JOINTS; SOLDER BALLS;

SOLDERED JOINTS;

EID: 42549124533     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280120     Document Type: Conference Paper

References (21)

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