Ion beam polishing for embedded cross-sections and its advantages for FESEM analysis in electronic packaging

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

Volumn , Issue , 2004, Pages 338-345

  Mack, W ^a   Seidl, B ^a   Fischer, R ^a   Ort, T ^a   Walter, J ^a   Grunewald J ^b   Berthold, L ^c   Petzold, M ^c  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b BAL TEC Innovation Centre   (Germany)

^c FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; FIELD EMISSION MICROSCOPES; INTEGRATED CIRCUITS; MICROELECTRONICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

ION BEAM POLISHING; MICROELECTRONIC PACKAGING; MICROSTRUCTURAL DIAGNOSIS;

ION BEAMS;

EID: 10444290642     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th Symposium for Testing and Failure Analysis, 2-6 Nov, St.Clara, CA, USA, (2003), p.288-296
2. Strecker, A. et al.; Optimization of TEM specimen preparation by double-sided ion beam thinning under low angles; Journal of Electron Microscopy, vol.48, no.3, (1999), p.235-244.
3. Strecker, A. et al.; Specimen preparation for transmission electron microscopy: reliable method for cross-sections and brittle materials, Praktische Metallographie, vol.30, no.10, (1993), p.482-495.
4. Ahbe, T.; Hasche, K. Hoffmann, K.-P.; Präparation von Querschnitten für Schichtdickenmessung; Proc. of Bal-Tec User Meeting, 29./30. April 1996, TU Erlangen (1996), p.55-63, BAL-TEC GmbH, Wielsiepen 38, D-58579 Schlaksmühle, Germany
5. Maßler, O.; Sockel, H.G.; Thermische Effekte beim Ionenstrahlätzen von TEM-Proben - Ursache, Ausmaß, Auswirkung und Vermeidung; Proc. of Bal-Tec User Meeting 29./30. April 1996, TU Erlangen (1996), p.3-8, BAL-TEC GmbH, Wielsiepen 38, D-58579 Schlaksmühle, Germany