Compositional effects on the creep properties of SnAgCu solder

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Wiese, S ^a   Kramer F ^a   Krause, M ^b   Bennemann, S ^b   Muller M ^a   Rollig M ^a   Petzold, M ^b   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE ALLOY; MICROSTRUCTURAL PROPERTIES; RAW SOLDER BARS;

CREEP; EUTECTICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 33847124087     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644017     Document Type: Conference Paper

References (7)

1. Morris Jr., J.W.; Song, H.G.; Hua, F., "Creep Properties of Sn-rich Solder Joints". Proc. IEEE 53th Electronics Components and Technology Conference, New Orleans, May 27 - 30, pp. 54 - 57
2. Mavoori, H., Chin, J., Vaynman, S., Moran, B., Keer, L.,Fine, M., "Creep, Stress Relaxation, and PlasticDeformation in Sn-Ag and Sn-Zn Eutectic Solders", Journal of Electronic Materials, Vol.26 (1997) No.7, pp. 783-790.
3. Pang, J.H.L.; Xiong, B.S.; Low, T.H., "Comprehensive Mechanics Characterization of Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder". Micromaterials and Nanomaterials, Vol.3 (2004), pp. 86 - 93
4. Schubert, A.; Walter, H.; Gollhart, A., Michel, B., "Material Mechanics and Reliability Issues of Lead-free Solder Interconnects", Proc. 2nd ESIME Conference, 2001, pp. 171-178.
5. Wiese, S.; Meusel, E.; Wolter, K.-J., "Microstructural Dependence of Constitutive Properties of eutectic SnAg and SnAgCu Solders". Proceedings IEEE 53th Electronic Components and Technology Conference, New Orleans, 27-30 May 2003, pp. 890-902
6. Kramer, P.A.; Glazer, J.; Morris Jr., J.W.: "The Effect of Low Gold Concentrations on the Creep of Eutectic Tin-Lead Joints". Metallurgical and Materials Trans. A, Vol. 25A (1994), pp. 1249 - 1257
7. Oliver, W.C.; Pharr, G.M., "An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Methods", Journal of Material Research, Vol. 7 (1992), pp.1563-1583