Deposition and CMP of sub 100 nm silver damascene lines

Microelectronic Engineering

Volumn 82, Issue 3-4 SPEC. ISS., 2005, Pages 273-276

  Emling, R ^a   Schindler, G ^b   Steinlesberger, G ^b   Engelhardt, M ^b   Gao, L ^a   Schmitt Landsiedel, D ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Ag; CMP; Interconnect; Metallization; Silver

Indexed keywords

ANNEALING; ELECTRIC CONDUCTIVITY; ELECTRIC POWER SYSTEM INTERCONNECTION; METALLIZING;

INTERCONNECT METALLIZATION; METALLIZATION STRUCTURES;

DEPOSITION;

EID: 28044454763     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.07.034     Document Type: Conference Paper

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