Enhancing solder joint fatigue life for ball grid array packages

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 701-706

  Wei, Zhou ^a   Kuan, Lim Beng ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; ENVIRONMENTAL TESTING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTERMETALLICS; SOLDERED JOINTS;

BALL GRID ARRAY PACKAGES; CRACK INITIATION AND PROPAGATION; EUTECTIC SOLDER BALLS; FINITE ELEMENT SIMULATIONS; PLASTIC BALL GRID ARRAYS; SIMULATION PREDICTION; SOLDER JOINT RELIABILITY; THERMAL-MECHANICAL BEHAVIOR;

ELECTRONICS PACKAGING;

EID: 84954062541     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271609     Document Type: Conference Paper

References (8)

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3. Shi, X. Q., Pang, H. L. J., Zhou, W., Wang, Z.P., "Low Cycle Fatigue Analysis of Temperature and Frequency Effect in Eutectic Solder Alloy," International Journal of Fatigue, Vol. 22, No. 3 (2000), pp. 217-228.
4. Shi, X. Q., Pang, H. L. J., Zhou, W., Wang, Z.P., "A Modified, Energy-Based, Low-Cycle Fatigue Model for Eutectic Solder Alloy," Scripta Materialia, Vol. 41, No. 3 (1999), pp. 289-296.
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7. Chan, MY, Ser, BL, Low, SW, Chia, YP, Eng, MK. "Methods for making semiconductor packages with leadframe grid arrays". US Patent and Trademark Office. Application No: 20030194837.
8. Chan, MY, Ser, BL, Low, SW, Chia, YP, Eng, MK. "Semiconductor packages with leadframe grid arrays and components and methods for making the same". US Patent and Trademark Office. Application No: 20030193091.