Effects of different surfactant additions and treatments on the characteristics of tin nanosolder by chemical reduction method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 431-435

  Huang, Po Chun ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS;

CHEMICAL REDUCTION METHODS; ELECTRONIC COMPONENTS; TIN NANO-PARTICLES;

SURFACE ACTIVE AGENTS;

EID: 51349084714     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550007     Document Type: Conference Paper

References (19)

1. L.Y. Hsiao and J.G. Duh, J. Electrochem. Soc. 152, J105 (2005).
2. M. L. Huang, C. M. L. Wu, J. K. L. Lai, L. Wang, and F. G. Wang, J. Mater. Sci.: Mater. Electron., 11, 57 2000.
3. H. L. Lai and J. G. Duh, J. Electron. Mater., 32, 215 2003.
4. S. T. Kao and J. G. Duh, J. Electron. Mater., 33, 1445 2004.
5. W. Yang, L. E. Felton, and R. W. Messler, Jr., J. Electron. Mater., 24, 1465 1995.
6. W. K. Choi and H. M. Lee, J. Electron. Mater., 29, 1207 2000.
7. T. Y. Lee, W. J. Choi, K. N. Tu, J. W. Jang, S. M. Kuo, J. K. Lin, D. R. Frear, K. Zeng, and J. K. Kivilahti, J. Mater. Res., 17, 291 2002.
8. W. H. Tao, C.Chen, C. E. Ho, W. T. Chen, and C. R. Kao, Chem. Mater., 13, 1051 (2001)
9. J.R. Oliver, J.Liu, and Z.Lai, Int. 2000 Symp. On Advanced Packaging Mater. 152(2000)
10. Y. Kariya, Y. Hirata, and M.Otsuka, J. Electron. Mater. 28, 1263 (1999)
11. K. Habu, N. Takeda, H. Watanabe, H. Ooki, J. Abe, T.Satio, Y. Taniguchi, and K. Takayama, Proc. 1999 IEEE Int. Symp. On Electronic and the Environment (Piscataway, NJ: IEEE, 1999), pp.21-24.
12. P.T. Vianco et al., U.S. patent 5,439,639 Aug. 8, (1995)
13. S. L. Lai,1 J. Y. Guo, 1 V. Petrova,2 G. Ramanath, 1 and L. H. Allen 1, PHYSICAL REVIEW LETTERS, VOL.77(1996)
14. R. R. Tummala and V. K. Madisetti, IEEE Des. Test Comput., 16, 48 1999.
15. F. H. Liu, J. C. Lu, V. Sundaram, D. Sutter, G. White, D. F. Baldwin, and R. R. Tummala, IEEE Trans. Compon. Packag. Technol., 25, 254 2002.
16. T. Ishii and S. Aoyama, J. Electron. Mater., 33, L21 2004.
17. H. S. Nalwa, Handbook of Nanostructured Materials and Nanotechnology, Vol. 1, Chap. 1, Academic Press, San Diego, CA 2000.
18. P. C. Huang and J. G. Duh, Journal of Nanoscience and Nanotechnology, In press.
19. C. H. Kuo, C. H. Chen and Michael H. Huang, Adv. Funct. Mater. 2007, 17, 3773-3780