Development of new Pb-free solder alloy of Sn-Ag-Bi system

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 1999, Pages 21-24

  Habu, Kazutaka ^a   Takeda, Naoko ^a   Watanabe, Haruo ^a   Ooki, Hiroshi ^a   Abe, Jiro ^a   Saito, Takashi ^a   Taniguchi, Yoshikuni ^a   Takayama, Kinjiro ^a  

^a SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL IMPACT; ENVIRONMENTAL PROTECTION; SOLDERING ALLOYS; TERNARY SYSTEMS; TIN ALLOYS;

LEAD-FREE SOLDERING ALLOYS;

CONSUMER ELECTRONICS;

EID: 0032650569     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)