A probabilistic mechanics approach to die cracking prediction in flip-chip ball grid array package

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 390-396

  Zhao, Jie Hua ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Die cracking; Finite element method (FEM); Four point bending; Probabilistic mechanics; Weibull

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PROBABILITY; STRESS CONCENTRATION; WEIBULL DISTRIBUTION;

DIE CRACKING; FOUR POINT BENDING; PROBABILISTIC MECHANICS;

CHIP SCALE PACKAGES;

EID: 27644558359     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853590     Document Type: Article

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