A probabilistic mechanics approach to die cracking prediction in flip-chip ball grid array package

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 177-183

  Zhao, Jie Hua ^a  

^a MOTOROLA INC   (United States)

Author keywords

4 point bend; Die cracking; Finite element method; Probabilistic mechanics; Weibull

Indexed keywords

4-POINT BEND; DIE CRACKING; DIE STRENGTH; PROBABILISTIC MECHANICS;

ARRAYS; BENDING (DEFORMATION); CRACK INITIATION; DIE CASTING; FINITE ELEMENT METHOD; PARAMETER ESTIMATION; PROBABILITY; TENSILE STRENGTH; WEIBULL DISTRIBUTION;

FLIP CHIP DEVICES;

EID: 4444284983     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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