Evaluation and analysis for mechanical strengths of low k dielectrics by a finite element method

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 72-74

  Aoi, N ^a   Fukuda, T ^a   Yanazawa, H ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FILMS; LOW-K DIELECTRIC; THIN FILMS;

EVALUATION AND ANALYSIS; FILM DENSITY; INORGANIC LOW-K; LINEAR DEPENDENCE; LOW-K FILMS; NANO-INDENTATION METHODS; RANDOM PORE MODEL;

FINITE ELEMENT METHOD;

EID: 84961755707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014891     Document Type: Conference Paper

References (4)

1. M. T. Bohr, Tech. Dig. IEDM, 241(1995).
2. N. Kawakami, et. al., Proc. IITC, 143(2000).
3. S. Lin, et. al., Proc. IITC, 146(2001).
4. N. Aoi, et. al., Abs. MRS Spring Meeting, 23(2001).