-
1
-
-
10644284881
-
High-power recessed-pate AlGaN-GaN HFET with a field-modulating plate
-
Dec
-
Y. Okamoto, Y. Ando, T. Nakayama, K. Hataya, H. Miyamoto, T. Inoue, M. Senda, K. Hirata, M. Kosaki, N. Shibata, and M. Kuzuhara, "High-power recessed-pate AlGaN-GaN HFET with a field-modulating plate," IEEE Trans. Electron Devices, vol. 51, no. 12, pp. 2217-2222, Dec. 2001.
-
(2001)
IEEE Trans. Electron Devices
, vol.51
, Issue.12
, pp. 2217-2222
-
-
Okamoto, Y.1
Ando, Y.2
Nakayama, T.3
Hataya, K.4
Miyamoto, H.5
Inoue, T.6
Senda, M.7
Hirata, K.8
Kosaki, M.9
Shibata, N.10
Kuzuhara, M.11
-
2
-
-
85205354386
-
40-W/mm double field-plated GaN HEMTs
-
Jun
-
Y. F. Wu, M. Moore, A. Saxler, T. Wisleder, and P. Parikh, "40-W/mm double field-plated GaN HEMTs," in Proc. Dig. Device Res. Conf., Jun. 2006, pp. 151-152.
-
(2006)
Proc. Dig. Device Res. Conf
, pp. 151-152
-
-
Wu, Y.F.1
Moore, M.2
Saxler, A.3
Wisleder, T.4
Parikh, P.5
-
3
-
-
41749096824
-
Recessed slant gate AlGaN/GaN high electron mobility transistors with 20.9 W/mm at 10 GHz
-
Nov
-
Y. Pei, R. M. Chu, N. A. Fichtenbaum, Z. Chen, D. Brown, L. Shen, S. Keller, S. P. DenBaars, and U. K. Mishra, "Recessed slant gate AlGaN/GaN high electron mobility transistors with 20.9 W/mm at 10 GHz," Jpn. J. Appl. Phys. 2, Lett., vol. 46, no. 45, pp. L1087-L1089, Nov. 2007.
-
(2007)
Jpn. J. Appl. Phys. 2, Lett
, vol.46
, Issue.45
-
-
Pei, Y.1
Chu, R.M.2
Fichtenbaum, N.A.3
Chen, Z.4
Brown, D.5
Shen, L.6
Keller, S.7
DenBaars, S.P.8
Mishra, U.K.9
-
4
-
-
27744444565
-
High-power AlGaN/GaN HEMTs for Ka-band applications
-
Nov
-
T. Palacios, A. Chakraborty, S. Rajan, C. Poblenz, S. Keller, S. P. DenBaars, J. S. Speck, and U. K. Mishra, "High-power AlGaN/GaN HEMTs for Ka-band applications," IEEE Electron Device Lett., vol. 26, no. 11, pp. 781-783, Nov. 2005.
-
(2005)
IEEE Electron Device Lett
, vol.26
, Issue.11
, pp. 781-783
-
-
Palacios, T.1
Chakraborty, A.2
Rajan, S.3
Poblenz, C.4
Keller, S.5
DenBaars, S.P.6
Speck, J.S.7
Mishra, U.K.8
-
5
-
-
46049092224
-
-
M. Micovic, A. Kurdoghlian, P. Hashimoto, M. Hu, M. Antcliffe, P. J. Willadsen, W. S. Wong, R. Bowen, I. Milosavljevic, A. Schmitz, M. Wetzel, and D. H. Chow, GaN HFET for W-band power applications, in IEDM Tech. Dig., Dec. 2006, pp. 15.6.1-15.6.3.
-
M. Micovic, A. Kurdoghlian, P. Hashimoto, M. Hu, M. Antcliffe, P. J. Willadsen, W. S. Wong, R. Bowen, I. Milosavljevic, A. Schmitz, M. Wetzel, and D. H. Chow, "GaN HFET for W-band power applications," in IEDM Tech. Dig., Dec. 2006, pp. 15.6.1-15.6.3.
-
-
-
-
6
-
-
1642359162
-
30-W/mm GaN HEMTs by field plate optimization
-
Mar
-
Y. F. Wu, A. Saxler, M. Moore, R. P. Smith, S. Sheppard, P. M. Chavarkar, T. Wisleder, U. K. Mishra, and P. Parikh, "30-W/mm GaN HEMTs by field plate optimization," IEEE Electron Device Lett., vol. 25, no. 3, pp. 117-119, Mar. 2004.
-
(2004)
IEEE Electron Device Lett
, vol.25
, Issue.3
, pp. 117-119
-
-
Wu, Y.F.1
Saxler, A.2
Moore, M.3
Smith, R.P.4
Sheppard, S.5
Chavarkar, P.M.6
Wisleder, T.7
Mishra, U.K.8
Parikh, P.9
-
7
-
-
33645646891
-
Unpassivated high power deeply recessed GaN HEMTs with fluorine-plasma surface treatment
-
Apr
-
L. Shen, T. Palacios, C. Poblenz, A. Corrion, A. Chakraborty, N. Fichtenbaum, S. Keller, S. P. Denbaars, J. S. Speck, and U. K. Mishra, "Unpassivated high power deeply recessed GaN HEMTs with fluorine-plasma surface treatment," IEEE Electron Device Lett., vol. 27, no. 4, pp. 214-216, Apr. 2006.
-
(2006)
IEEE Electron Device Lett
, vol.27
, Issue.4
, pp. 214-216
-
-
Shen, L.1
Palacios, T.2
Poblenz, C.3
Corrion, A.4
Chakraborty, A.5
Fichtenbaum, N.6
Keller, S.7
Denbaars, S.P.8
Speck, J.S.9
Mishra, U.K.10
-
8
-
-
41749090482
-
Correlation between DC-RF dispersion and gate leakage in deeply-recessed GaN/AlGaN/GaN HEMTs
-
Apr
-
R. M. Chu, L. K. Shen, N. Fichtenbaum, Z. Chen, S. Keller, S. P. DenBaars, and U. K. Mishra, "Correlation between DC-RF dispersion and gate leakage in deeply-recessed GaN/AlGaN/GaN HEMTs," IEEE Electron Device Lett., vol. 29, no. 4, pp. 303-305, Apr. 2008.
-
(2008)
IEEE Electron Device Lett
, vol.29
, Issue.4
, pp. 303-305
-
-
Chu, R.M.1
Shen, L.K.2
Fichtenbaum, N.3
Chen, Z.4
Keller, S.5
DenBaars, S.P.6
Mishra, U.K.7
-
9
-
-
34748914980
-
6 mixtures
-
Aug
-
6 mixtures," in Proc. IEEE Lester Eastman Conf. High Perform. Devices. Aug. 2004, pp. 132-137.
-
(2004)
Proc. IEEE Lester Eastman Conf. High Perform. Devices
, pp. 132-137
-
-
Buttari, D.1
Chini, A.2
Chakraborty, A.3
McCarthy, L.4
Xing, H.5
Palacios, T.6
Shen, L.7
Keller, S.8
Mishra, U.K.9
-
10
-
-
34748870229
-
Deep-recessed GaN HEMTs using selective etch technology exhibiting high microwave performance without surface passivation
-
Jun
-
L. Shen, Y. Pei, L. McCarthy, C. Poblenz, A. Corrion, N. Fichtenbaum, S. Keller, S. P. Denbaars, J. S. Speck, and U. K. Mishra, "Deep-recessed GaN HEMTs using selective etch technology exhibiting high microwave performance without surface passivation," in Proc. IEEE MTT Int. Microw. Symp., Jun. 2007, pp. 623-626.
-
(2007)
Proc. IEEE MTT Int. Microw. Symp
, pp. 623-626
-
-
Shen, L.1
Pei, Y.2
McCarthy, L.3
Poblenz, C.4
Corrion, A.5
Fichtenbaum, N.6
Keller, S.7
Denbaars, S.P.8
Speck, J.S.9
Mishra, U.K.10
-
11
-
-
41749103778
-
Plasma treatment for leakage reduction in AlGaN/GaN and GaN Schottky diodes
-
Apr
-
R. M. Chu, L. K. Shen, N. Fichtenbaum, D. Brown, S. Keller, and U. K. Mishra, "Plasma treatment for leakage reduction in AlGaN/GaN and GaN Schottky diodes," IEEE Electron Device Lett., vol. 29, no. 4, pp. 297-299, Apr. 2008.
-
(2008)
IEEE Electron Device Lett
, vol.29
, Issue.4
, pp. 297-299
-
-
Chu, R.M.1
Shen, L.K.2
Fichtenbaum, N.3
Brown, D.4
Keller, S.5
Mishra, U.K.6
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