BCB (benzocylcobutene) process integration for the RF passive device

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 40-45

  Li, H Y ^a   Tang, M ^a   Guo, L H ^a   Lo, G Q ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ACCESSORIES; ANTENNAS; ELECTRONICS PACKAGING; TECHNOLOGY;

ELECTRICAL YIELD; ON-CHIP ANTENNAS; PACKAGING TECHNOLOGIES; PASSIVE DEVICES; PROCESS INTEGRATION; PROCESS TIME; Q VALUES; RADIO-FREQUENCY;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249172990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342688     Document Type: Conference Paper

References (8)

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7. Gregory F. Meyers and Michael T. Dineen, "Characterization of the surface structural, Mechanical, and thermal properties of Benzocyclobutene dielectric polymers using scanned probe Microscopy" Macromol. Symp. 2001, 166, pp213-226.
8. H. Y. Li, W. H. Li, L. Y. Wong, and N. Hwang, " Built-in Via module test structure for backend interconnection in line process monitor," IPFA 2005 proceeding P. 167-170