Investigation of void-free electroplating method on copper column based solder bump for flip-chip interconnections

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 112-117

  Yamada, Hiroshi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FLIP CHIP DEVICES; INTERFACES (MATERIALS); SURFACE TENSION; SURFACE TREATMENT; ULTRAVIOLET RADIATION;

FLIP CHIP INTERCONNECTIONS; OXYGEN PLASMA TREATMENT; SOLDER BUMPS; VOID FREE ELECTROPLATING;

ELECTROPLATING SOLUTIONS;

EID: 33847317326     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598245     Document Type: Conference Paper

References (6)

1. R. Tummala, E. Rymaszerski, A. Klopfenstein Editors, Microelectronics Packaging Handbook, London, U. K., Chapman & Hall, 1997.
2. D. Edwards, H. Chambers, M. Farooq, L. Goldmann, A. Salehi, "Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5," Proceedings of 54th Electronics Components & Technology Conference (ECTC) pp.407-412, Las Vegas, Nevada, June 1-4, 2004.
3. J. H. Lau Editors, Flip Chip Technologies, New York, McGraw Hill, 1995.
4. H. Yamada, T. Togasaki, K. Tateyama, K. Higuchi, "Advanced Copper Column Based Solder Bump for Flip-Chip Interconnection," Proceedings of 1997 ISHM, pp.417-422, Philadelphia, Pennsylvania, October 12-16, 1997.
5. H. Yamada, T. Togasaki, "Resin flow characteristics of encapsulant for flip-chip interconnection," IEEE Transactions on Components and Packaging Technologies, vol.26, no.1, pp.268-274, March 2003.
6. H. Yamada, T. Togasaki, "Optimization of copper column based solder bump design for high reliability flip-chip interconnections," Proceedings of 55th Electronics Components & Technology Conference (ECTC) pp.94-99, Orland, Florida, May 31- June 3, 2005.