A novel integrated passive substrate fabricated directly on an organic laminate for RF applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 672-675

  Okubora, Akihiko ^a   Ogawa, Tsuyoshi ^a   Hirabayashi, Takayuki ^a   Kosemura, Takahiko ^a   Ogino, Tetsuya ^a   Nakayama, Hirokazu ^a   Oya, Youichi ^a   Nishitani, Yuji ^a   Asami, Yukio ^a  

^a SONY CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COPPER; ELECTRIC INDUCTORS; ELECTROPLATING; LAMINATES; MICROSTRIP DEVICES;

ORGANIC LAMINATES;

THIN FILMS;

EID: 0036297122     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Rf-microwave multi-layer integrated passives using fully organic system on package(SOP) technology
2. Silicon MCM-D technology for RF integration
3. RF/microwave characterization of multilayer ceramic based MSM technology
4. High-Q spiral inductors for high performance integrated RF front-end sub-system