Wafer level thin film encapsulation for MEMS

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 1, Issue , 2005, Pages 243-247

  Gillot, C ^a   Pornin, J L ^a   Arnaud, A ^a   Lagoutte, E ^a   Sillon, N ^a   Souriau, J C ^a  

^a CEA LETI   (France)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; THIN FILM CIRCUITS;

MANUFACTURING COST; THIN FILM PACKAGING;

ELECTRONICS PACKAGING;

EID: 33847336510     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Najafi, K., "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS", Micromachining and Microfabrication Process Technology VII, Proc. Of SPIE, Vol. 4979, 2003.
2. Starck, B.H., Najafi, K., "A Low-Temperature Thin-Film Electroplated Metal Vacuum Package", Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 147-157, April, 2004.
3. Bartek, M., Foerster, J.A., Wolffenbuttel, R.F., "Vacuum sealing of microcavities using metal evaporation", Sensors and Actuators, A61, pp. 364-368, 1997.
4. Gillot, C., Sillon, N., Robert, P., Dahan, E., Baillin, X., Lagoutte, E., "Wafer Level Hermetic Packaging for Above-IC RF MEMS: Process and Characterization", IMAPS International Workshop on Microelectronics, Long Beach, USA, Nov 14-18, 2004.