Backside IR photon emission microscopy (IR-PEM) observation in failure analysis of the packaged devices

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages

  Tao, Jianlei ^a   Fang, Peiyuan ^a   Wang, Jiaji ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FAILURE ANALYSIS; LITHOGRAPHY; METALS; NONMETALS; PHOTONS; QUALITY ASSURANCE; RELIABILITY; SAFETY FACTOR; SILICON; SILICON WAFERS; TECHNOLOGY;

DE-CAPSULATION; ELECTRONIC PACKAGING; INTERNATIONAL CONFERENCES; IR EMISSIONS; METAL INTERCONNECTIONS; PACKAGED DEVICES; PHOTON EMISSION MICROSCOPY; SILICON SUBSTRATES; WAFER LEVELS;

CHIP SCALE PACKAGES;

EID: 50249134159     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2007.4441539     Document Type: Conference Paper

References (8)

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