New applications of the infrared emission microscopy to wafer-level backside and flip-chip package analyses

IEEE International Integrated Reliability Workshop Final Report

Volumn 2002-January, Issue , 2002, Pages 147-150

  Hsiung, Steve ^a   Tan, Kevan ^a   Luo, Joe ^a  

^a LSI Lo ei c Cornoration   (United States)

Author keywords

Backside photon emissions microscopy; Flip chip packages; Iniiared emission microscopy

Indexed keywords

CHIP SCALE PACKAGES; DIES; FLIP CHIP DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

BACKSIDE PHOTON EMISSION MICROSCOPY; EMISSION MICROSCOPY; FLIP-CHIP PACKAGES; INFRARED EMISSIONS; INIIARED EMISSION MICROSCOPY; NEW APPLICATIONS; PHOTON EMISSION MICROSCOPY; REAL- TIME; SEMICONDUCTOR INDUSTRY; WAFER LEVEL;

PHOTONS;

EID: 50249090328     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2002.1194254     Document Type: Conference Paper

References (5)

1. IREM Laborites, IREM Instruction Manual
2. R. Clark, Emission Microscopy Sports IC Failure Mechanisms, OE Report, February 1995
3. D. Barton, etc, Infrared Light Emission From Semiconductor Devices, ISTFA Proceedings, 1996, pp.9-17
4. S. Hsiung and V. Chan, Failure Analysis Process Flow and Common Failure Mechanisms in Flip-chip Packaged Devices, ISTFA Proceedings, 2000, pp. 107-115
5. S. Hsiung, K. Tan and J. Juo, New Techniques for the Identification of Defects in Multi-layer Flip-Chip Packages.ISTFA Proceedings, 2001, pp. 243-250