Design and thermo-mechanical analysis of a dimple-array interconnect technique for power semiconductor devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 378-383

  Wen, S S ^a   Huff, D ^a   Lu, G Q ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER AIDED DESIGN; PERFORMANCE; RELIABILITY; SEMICONDUCTOR DEVICES; SHEET METAL; SOLDERED JOINTS; SOLDERING ALLOYS; THERMOANALYSIS;

DIMPLE ARRAY INTERCONNECT; ELECTRICAL CONNECTIONS; THERMO-MECHANICAL ANALYSIS;

ELECTRONICS PACKAGING;

EID: 0034838074     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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