A solder bumping interconnect technology for high-power devices

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 6, Issue , 2004, Pages 4183-4187

  Hase K ^a   Lefranc, G ^a   Zellner, M ^a   Licht, T ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH-POWER DEVICES; SEMICONDUCTOR CHIPS; SOLDER BUMPING; SOLDER PASTE ALLOYS;

ALUMINA; COPPER; INDUCTANCE; METALLIZING; PHOTOLITHOGRAPHY; SEMICONDUCTOR MATERIALS; SILICON WAFERS; SUBSTRATES;

MICROPROCESSOR CHIPS;

EID: 8744308269     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1354739     Document Type: Conference Paper

References (7)

1. De-Shin Liu, Chin-Yu Ni, A study on electrical resistance of solder joint interconnections, Microelectronic Engineering 63 (2002) 363-372
2. See for instance www.infineon.com/optimos; app.- note ANPS071E
3. K. Sommer, J. Göttert, G. Lefranc, R. Spanke, Multichip high power IGBT-Modules for traction and industrial application, Proc. of EPE Conf., Trondheim, September 1997.
4. M.Sumikawa, T. Sato, C. Yoshioka, T. Nukii, Reliability of soldered joints in CSPs of various designs and mounting conditions, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No.2, June 2001 293-299
5. Hamidi A., Coquery G., Lallemand R., Reliability of high power IGBT modules, Testing on thermal fatigue effects due to traction cycles. Proc. of EPE Conf., Trondheim, September 1997.
6. Lefranc G., Licht T., Schultz H.J., Beinert R., Mitic G., "Reliability testing of high power multi-chip IGBT modules". Microelectronics Reliability Vol. 40 (2000) pp.1659-1663.
7. Jacob P., Held M., Scacco P., Wu W., Reliability testing and analysis of IGBT power semiconductor modules, IEE proc. IGBT propulsion drives, London (1995) pp.4/1-4/5.