SOI-CMOS platform for monolithically integrating high-voltage driver circuits with bulk-micromachined actuators

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 1329-1332

  Takahashi, K ^a,b   Mita, M ^a   Fujita, H ^a   Toshiyoshi, H ^a,b   Suzuki, K ^c   Funaki, H ^c   Itaya, K ^c  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY   (Japan)

^c TOSHIBA CORPORATION   (Japan)

Author keywords

Bulk micromachining; CMOS MEMS; Post processed MEMS; TOLASAM

Indexed keywords

ACTUATORS; ASPECT RATIO; AUTOMOBILE DRIVERS; CHARGE COUPLED DEVICES; CMOS INTEGRATED CIRCUITS; DATA STORAGE EQUIPMENT; ELECTRON BEAM LITHOGRAPHY; INTEGRATION; METALLIC COMPOUNDS; METALS; MICROSYSTEMS; MONOLITHIC INTEGRATED CIRCUITS; MOS DEVICES; MOTION CONTROL; NETWORKS (CIRCUITS); NONMETALS; OPTICAL DESIGN; REACTIVE ION ETCHING; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR MATERIALS; SENSORS; SILICON; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; TRANSDUCERS;

BOTTOM SURFACES; BULK-MICROMACHINED; BULK-MICROMACHINING; CMOS-MEMS; DEEP REACTIVE ION ETCHING; DRIVER CIRCUITS; HIGH VOLTAGES; HIGH-ASPECT RATIO STRUCTURES; INTERNATIONAL CONFERENCES; METAL-OXIDE SEMICONDUCTORS; MONOLITHIC INTEGRATIONS; MULTI-LAYERED; POST-PROCESSED MEMS; POST-PROCESSING; SILICON-ON -INSULATOR; SOLID-STATE SENSORS; TECHNOLOGY PLATFORMS; THICK SOI; TOLASAM;

ELECTROSTATIC ACTUATORS;

EID: 50049118010     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300386     Document Type: Conference Paper

References (10)

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