The properties of TiN thin films deposited by pulsed direct current magnetron sputtering

Thin Solid Films

Volumn 516, Issue 21, 2008, Pages 7294-7298

  Yeh, Tung Sheng ^a,b   Wu, Jenn Ming ^a   Hu, Long Jang ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Properties; Pulsed dc magnetron sputtering; Titanium nitride films

Indexed keywords

HARDNESS; MAGNETRONS; NITRIDES; SCALE (DEPOSITS); SPUTTER DEPOSITION; THICK FILMS; TIN; TITANIUM; TITANIUM COMPOUNDS; TITANIUM NITRIDE;

DC SPUTTERING; DIRECT CURRENT; LOW RESISTIVITY; PROPERTIES; PULSE FREQUENCIES; PULSED DC; PULSED DC MAGNETRON SPUTTERING; PULSED DIRECT CURRENT; SPUTTERED FILMS; SPUTTERING PRESSURES; TIN THIN FILMS; TITANIUM NITRIDE FILMS;

MAGNETRON SPUTTERING;

EID: 49349104693     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.01.001     Document Type: Article

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