Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering

Thin Solid Films

Volumn 494, Issue 1-2, 2006, Pages 146-150

  Benegra, M ^a   Lamas, D G ^b   Fernandez De Rapp M E ^b   Mingolo, N ^c   Kunrath, A O ^d   Souza, R M ^a  

^a UNIVERSITY OF SÃO PAULO   (Brazil)

^b Instituto de Investigaciones Cientificas y Tecnicas de Las Fuerzas Armadas   (Argentina)

^c DEPARTAMENTO DE FÍSICA   (Argentina)

^d Department of Geology and Geological Engineering   (United States)

Author keywords

Plasma processing and deposition; Sputtering; Stress; Titanium nitride

Indexed keywords

DEPOSITION; ELECTRIC CURRENTS; MAGNETRON SPUTTERING; RESIDUAL STRESSES; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

DEPOSITION PARAMETERS; PLASMA PROCESSING AND DEPOSITION;

THIN FILMS;

EID: 27844553902     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.08.214     Document Type: Conference Paper

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