Bonding wire characterization using automatic deformability measurement

Microelectronic Engineering

Volumn 85, Issue 8, 2008, Pages 1795-1803

  Hang, C J ^a,b   Lum, I ^b   Lee, J ^b   Mayer, M ^b   Wang, C Q ^a   Zhou, Y ^b   Hong, S J ^c   Lee, S M ^c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b UNIVERSITY OF WATERLOO   (Canada)

^c MK Electron Co Ltd   (South Korea)

Author keywords

Copper wire; Deformability; Free air ball; On line; Thermosonic; Wire bonding

Indexed keywords

BONDING; CHIP SCALE PACKAGES; DEFORMATION; ELECTRONIC EQUIPMENT MANUFACTURE; HARDNESS; METALLIZING; NONVOLATILE STORAGE; WIRE;

CHARACTERIZATION METHODS; COMPARISON STUDIES; IC PACKAGING; LABOUR INTENSIVE; METALLIZATION; MICRO INDENTATION TESTING; SUBSTRATE TEMPERATURE (ST); WIRE BONDERS; WIRE BONDING (WB);

ELECTRONICS PACKAGING;

EID: 48949115610     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.05.008     Document Type: Article

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