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Volumn 234-236, Issue , 1997, Pages 810-813
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The influence of temperature and strain rate on microstructural evolution of polycrystalline copper
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Author keywords
Compression test; Copper; High strain rate deformation; Microstructure
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Indexed keywords
COMPRESSION TESTING;
CRYSTAL MICROSTRUCTURE;
DEFORMATION;
DISLOCATIONS (CRYSTALS);
HARDNESS;
MATHEMATICAL MODELS;
POLYCRYSTALLINE MATERIALS;
SENSITIVITY ANALYSIS;
STRAIN RATE;
THERMAL EFFECTS;
X RAY CRYSTALLOGRAPHY;
BALLISTIC TESTING SYSTEM;
HIGH STRAIN RATE DEFORMATION;
STRESS STRAIN DIAGRAMS;
COPPER;
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EID: 0041734301
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/s0921-5093(97)00305-5 Document Type: Article |
Times cited : (20)
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References (7)
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