FEM study of deformation and stresses in copper wire bonds on Cu LowK structures during processing

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 906-912

  Degryse, Dominiek ^a   Vandevelde, Bart ^a   Beyne, Eric ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELASTIC MODULI; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; INTERMETALLICS; PERMITTIVITY; STRESSES; TENSILE STRENGTH;

BOND PAD; LINE INTERCONNECTS; METAL LAYERS; WIRE BONDS;

COPPER;

EID: 10444287578     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Ming-Dou Ker and Jeng-Jie Peng, "Fully Process-Compatible Layout Design on Bond Pad to Improve Wire Bond Reliability in CMOS ICs" IEEE Transactions on components and packaging technologies, Vol. 25, No. 2 (June 2002), pp. 309-331.
2. st ECTC Conference, Orlando, FL, May 2001, pp. 965-970.
3. th Annual International Reliability Physics Symposium, Reno, Nevada, 1998, pp. 225-231.
4. Degryse, D. et all "Mechanical FEM Simulation of Bonding Process on Cu LowK Wafers" Proceedings of EuroSIME 2003, Aix-en-Provence, France, March 30-April 2 2003, pp. 345-351.
5. th EPTC Conference, Singapore, December 10-12 2003, pp. 815-820.
6. Degryse, D. et all "Finite Element Modeling of Shear Test on Bumped Cu LowK Wafers" presented at IMAPS Cu lowK workshop, San Diego, Ca, December 15-17 2003.