A thick photoresist process for open-channel sensing packaging applications by JSR THB-151N negative UV photoresist

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 288-291

  Hsu, Chung Yi ^b   Chen, Lung Tai ^b   Chang, Jin Sheng ^b   Chu, N Hsun ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

CLADDING (COATING); ENCAPSULATION; MICROSYSTEMS; OPEN CHANNEL FLOW; OPTICAL DESIGN; PHOTORESISTORS; SURFACE TREATMENT; TECHNOLOGY;

CHANNEL SENSING; COATING PROCESSES; FABRICATION PARAMETERS; OPEN SPACE; PACKAGING APPLICATIONS; PACKAGING STRUCTURE; REPLACEMENT METHOD; REPRODUCIBILITY; SIDEWALL PROFILES; THICK PHOTORESISTS; UV PHOTORESIST;

PHOTORESISTS;

EID: 48649085441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433619     Document Type: Conference Paper

References (7)

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