Novel packaging technique and its application to a wet/wet differential pressure silicon sensor

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 275-278

  Krassow, H ^a   Heimlich, D ^a   Campabadal, F ^a   Lora Tamayo, E ^a  

^a CSIC   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; SILICON SENSORS;

DIFFERENTIAL PRESSURE SILICON SENSORS;

ELECTRONICS PACKAGING;

EID: 0030650985     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)