3D thermal model to investigate component displacement phenomenon during reflow soldering

Microelectronics Reliability

Volumn 48, Issue 7, 2008, Pages 1062-1068

  Illés, Balázs ^a   Harsányi, Gábor ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CALCULATIONS; DIFFERENCE EQUATIONS; FINITE DIFFERENCE METHOD; FLIP CHIP DEVICES; HEAT CONDUCTION; MODAL ANALYSIS; NUMERICAL ANALYSIS; PAINTING; PROCESS MONITORING; SOLDERING; STEEL ANALYSIS; TEMPERATURE DISTRIBUTION; THERMOANALYSIS; THERMOGRAPHY (TEMPERATURE MEASUREMENT); THERMOSTATS; WELDING;

(+ MOD 2N) OPERATION; (E ,3E) PROCESS; AREAS OF INTEREST (AOI); CALCULATION ACCURACY; CALCULATION SPEED; CONTACT SURFACES; DETAILED MODELS; DISCRETE COMPONENTS; DISCRETIZATION; ELSEVIER (CO); FINITE DIFFERENCE (FD); GENERAL (CO); IN ORDER; MODEL COMPLEXITY; NODE THEORY; NON UNIFORM; PROCESS MODELLING; REFLOW SOLDERING; ROOT CAUSES; SPATIAL RESOLUTION (SR); SUBSTRATE TEMPERATURE (ST); TEMPERATURE DEVIATION;

THREE DIMENSIONAL;

EID: 48149115688     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.04.007     Document Type: Article

References (14)

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