Modelling heat transfer efficiency in forced convection reflow ovens

ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings

Volumn , Issue , 2006, Pages 80-85

  Illés, Balázs ^a   Krammer, Olivér ^a   Harsányi, Gábor ^a   Illyefalvi Vitéz, Zsolt ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; FORCED CONVECTION; HEATING; OVENS; RIVERS; SOLDERING; SPRINGS (COMPONENTS); TECHNOLOGY; WELDING;

(1 1 0) SURFACE; (PL) PROPERTIES; CONFERENCE PROCEEDINGS; ELECTRONICS TECHNOLOGY; HEAT TRANSFER EFFICIENCY; HEATING EFFICIENCY; HIGH IMPACT; INTERNATIONAL (CO); LAMINAR PHASE; NANO TECHNOLOGIES; RADIAL PHASE; REFLOW OVENS; REFLOW SOLDERING; TRANSITION PHASE; VECTOR SPACES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 46449107666     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2006.365363     Document Type: Conference Paper

References (6)

1. Lajos Tamás, Az áramlástan alapjai, (in hungarian), Müegyetemi Kiadó, Budapest 2004, pp. 82-92.
2. D.C. Whalley, A simplified reflow soldering process model, Journal of Materials Processing Technology 150 (2004) pp. 134-144.
3. Harsányi Gábor - Illyefalvi-Vitéz Zsolt - Ripka Gábor, Multichip modulok (in Hungarian), Müegyetemi Könyvkiado, 2000. pp 49-52.
4. Lajos Tamás, Az áramlástan alapjai, (in hungarian), Müegyetemi Kiadó, Budapest 2004, pp. 109-129.
5. Guido Finzer: Lötversuch T0263-Mehrpoler auf neuem herstellerunabhängigen Land, (in Greman), 2004. (Bosch Automobilelektronik)
6. rehm Anlagenbau GmbH, Documentation V8 Reflow oven, http://www.rehm- anlagenbau.de/en/jsindex.htm