Thermal simulation for predicting substrate temperature during reflow soldering process

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 1021-1026

  Inoue, Michinobu ^a   Koyanagawa, Takashi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FLUID DYNAMICS; HEAT TRANSFER; INFRARED RADIATION; MELTING; OPTIMIZATION; SOLDERING ALLOYS; TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

ELECTRONIC COMPONENTS; IMPINGING JETS; LEAD-FREE SOLDERS; THERMAL SIMULATION;

SOLDERING;

EID: 24644452630     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. JSME Data Book, Heat Transfer. The 4th Edition.
2. Martin, H., "Heat and mass transfer between impinging gas jets and solid surfaces," Advanced Heat Transfer" Vol. 13 (1977), pp. 1-60.
3. Nakao, K., Hiraizumi, A.,and Iwasaki, E., "Reflow Oven for a Pb-Free Soldering Process," Furukawa Review, No. 20 (2001), pp. 77-82.