Effective modeling of the reflow soldering process: Basis, construction, and operation of a process model

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 2, 1998, Pages 126-133

  Sarvar, Farhad ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; OPTIMIZATION; PRINTED CIRCUIT DESIGN; SOLDERING;

DESIGN FOR MANUFACTURE; REFLOW SOLDERING;

PRINTED CIRCUIT MANUFACTURE;

EID: 0032047925     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.681389     Document Type: Article

References (14)

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