3D investigations of the internal convection coefficient and homogeneity in reflow ovens

ISSE 2007 - 30th International Spring Seminar on Electronics Technology 2007; Conference Proceedings: Emerging Technologies for Electronics Packaging

Volumn , Issue , 2007, Pages 320-325

  Illés, Balázs ^a   Krammer, Oliver ^a   Harsányi, Gábor ^a   Illyefavi Vitéz, Zsolt ^a   Szabó, András ^b  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b RBHH/TEF2   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FIBER OPTIC SENSORS; FLUXES; HEAT FLUX; HEATING; HEATING EQUIPMENT; MAPS; MEASUREMENTS; NOZZLES; OVENS; PACKAGING; SEMICONDUCTOR QUANTUM DOTS; SOLDERING; SPRINGS (COMPONENTS); STOVES; TECHNOLOGY; THREE DIMENSIONAL; WELDING;

CONFERENCE PROCEEDINGS; CONVECTION COEFFICIENTS; CONVECTION HEAT FLUX; ELECTRONICS TECHNOLOGY; EMERGING TECHNOLOGIES; INTERNAL HEATING; INTERNATIONAL (CO); MEASURING METHODS; REFLOW OVENS; REFLOW SOLDERING; Z DIRECTIONS;

FLIP CHIP DEVICES;

EID: 44849104646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2007.4432871     Document Type: Conference Paper

References (4)

1. D.C. Whalley, A simplified reflow soldering process model, Journal of Materials Processing Technology 150 (2004) pp. 134-144.
2. Michinobu Inoue and Takashi Koyanagawa, Thermal Simulation for Predicting Substrate Temperature during Reflow Soldering Process, 2005 Electronic Components and Technology Conference, pp. 1021-1026.
3. G. Hanreich, J. Nicolics, Measuring the Natural Convective Heat Transfer Coefficient at the Surface of Electronic Components, IEEE 2001 Instrumentation and Measurement Technology Conference, pp 1045-1050.
4. th Int. Spring Seminar on Elctronics Technology, pp. 80-85.