Simultaneously increasing the ductility and strength of ultra-fine-grained pure copper

Advanced Materials

Volumn 18, Issue 22, 2006, Pages 2949-2953

  Zhao, Yong Hao ^a   Bingert, John F ^a   Liao, Xiao Zhou ^b   Cui, Bao Zhi ^c   Han, Ke ^c   Sergueeva, Alla V ^d   Mukherjee, Amiya K ^d   Valiev, Ruslan Z ^e   Langdon, Terence G ^f   Zhu, Yuntian T ^a  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF SYDNEY   (Australia)

^c FLORIDA STATE UNIVERSITY   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

^e Birsk Branch of Federal State Budgetary Educational Establishment of Higher Education Bashkir State University   (Russian Federation)

^f UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUCTILITY; ELECTRON DIFFRACTION; GRAIN BOUNDARIES; LOW TEMPERATURE OPERATIONS; MICROSTRUCTURE; PLASTIC DEFORMATION; TRANSMISSION ELECTRON MICROSCOPY;

LIQUID NITROGEN; PRE EXISTING DEFORMING TWINS (PDT); ULTRA FINE GRAINED (UFG) PURE COPPER;

COPPER;

EID: 33845212925     PISSN: 09359648     EISSN: None     Source Type: Journal    
DOI: 10.1002/adma.200601472     Document Type: Article

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