Technology and application of 3D interconnect

Proceedings 2007 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT

Volumn , Issue , 2007, Pages 176-179

  Jones, Robert E ^a,b   Chatterjee, Ritwik ^b   Pozder, Scott ^b  

^a IEEE

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CELLULAR RADIO SYSTEMS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; TECHNOLOGY;

INTEGRATED CIRCUIT (IC) DESIGN; INTERCONNECT PERFORMANCE; INTERNATIONAL CONFERENCES; NEW DESIGN; NEW PROCESSES; SYSTEM IN PACKAGE (SIP); SYSTEM INTEGRATION (SI); SYSTEM ON CHIP (SOCS); THREE DIMENSIONAL (3-D) INTEGRATION;

INTEGRATED CIRCUITS;

EID: 47349110849     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICICDT.2007.4299567     Document Type: Conference Paper

References (12)

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